Innovation in System Interfacing and Control
mbs:  /  Design Services  /  Test Qual
21. May 2012
Test QualTest QualifikationTest Qual
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Test and Qualification



Test and Qualification

 

Dynamic Stress Testing

Environmental Stress Screening Plans, marginal design tolerances, workmanship errors and manufacturing process variations can create latent defects in a manufactured product which may not be apparent during normal acceptance testing, but which will result in failures later in the manufacturing process, or under the stresses of the operational environment. These latent deficiencies produce a high failure rate in the early phases of the product/system life cycle. An effective method for reducing the number of delivered latent defects in a product is environmental stress screening (ESS).

End Product Qualification

MBS can provide support and guidance on the qualification of customer's products. MBS can plan and organise qualification programmes for all levels of testing.
Qualification test plans, procedures and reports can be generated for all areas of product qualification that meet FAA JAA requirements.
MBS has many years of experience in the design of products operating in harsh environments, where they are subjected to extreme temperatures, thermal cycling and high shock and vibration conditions.

 MBS can provide support in the design of both air-cooled and conduction cooled products as well as techniques to improve the thermal and mechanical robustness, including stiffening bars, heat sinks/spreaders, PCB design and layout.

Conduction-cooled cards can be utilised in applications where there is no direct cooling air, or where there are requirements for reliable operation when cooled air is removed for sustained periods. MBS has experience in advanced cooling techniques such as the use of aluminium frames, top-side copper shunts or dedicated cooling layers in the PCB's. These all provide low thermal resistive paths for the conduction of heat from the electronic components to the edge of the card where it is transferred to the chassis.